Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures
High-performance semiconductor films with vertical compositions that are designed to
atomic-scale precision provide the foundation for modern integrated circuitry and
novel materials discovery1,2,3. One approach to realizing such
films is sequential layer-by-layer assembly, whereby atomically thin two-dimensional
building blocks are vertically stacked, and held together by van der Waals
interactions4,5,6. With this approach, graphene and
transition-metal dichalcogenides—which represent one- and three-atom-thick
two-dimensional building blocks, respectively—have been used to realize
previously inaccessible heterostructures with interesting physical properties7,8,9,10,11. However, no large-scale assembly method exists at
present that maintains the intrinsic properties of these two-dimensional building
blocks while producing pristine interlayer interfaces12,13,14, Publisher URL: http://dx.doi.org/10.1038/nature23905 DOI: 10.1038/nature23905
Publisher URL: http://dx.doi.org/10.1038/nature23905
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