3 years ago

Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures

Layer-by-layer assembly of two-dimensional materials into wafer-scale             heterostructures
Saien Xie, Kibum Kang, David A. Muller, Jiwoong Park, Hui Gao, Yimo Han, Kan-Heng Lee

High-performance semiconductor films with vertical compositions that are designed to atomic-scale precision provide the foundation for modern integrated circuitry and novel materials discovery1,2,3. One approach to realizing such films is sequential layer-by-layer assembly, whereby atomically thin two-dimensional building blocks are vertically stacked, and held together by van der Waals interactions4,5,6. With this approach, graphene and transition-metal dichalcogenides—which represent one- and three-atom-thick two-dimensional building blocks, respectively—have been used to realize previously inaccessible heterostructures with interesting physical properties7,8,9,10,11. However, no large-scale assembly method exists at present that maintains the intrinsic properties of these two-dimensional building blocks while producing pristine interlayer interfaces12,13,14,

Publisher URL: http://dx.doi.org/10.1038/nature23905

DOI: 10.1038/nature23905

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