Wetting Regimes for Residual-Layer-Free Transfer Molding at Micro- and Nanoscales

3 years ago

Wetting Regimes for Residual-Layer-Free Transfer Molding at Micro- and Nanoscales

Chaitanya K. Ullal, Michael E. Deagen, Linda S. Schadler

Transfer molding offers a low-cost approach to large-area fabrication of isolated structures in a variety of materials when recessed features of the open-faced mold are filled without leaving a residual layer on the plateaus of the mold. Considering both macroscale dewetting and microscale capillary flow, a proposed map of wetting regimes for blade meniscus coating provides a guide for achieving discontinuous dewetting at maximum throughput. Dependence of meniscus morphology on the azimuthal orientation of the stamp provides insight into the dominant mechanisms for discontinuous dewetting of one-dimensional (1-D) patterns. Critical meniscus velocity is measured and residual-layer-free filling is demonstrated for 1-D patterned soft molds (stamps) with periods ranging from 140 nm to 6 μm. Transfer of isolated lines, and multilayer woodpile structures were achieved through plasma bonding. These results are relevant to other roll-to-roll compatible processes for scalable production of high-resolution structures across large areas.

Publisher URL: http://dx.doi.org/10.1021/acsami.7b09402

DOI: 10.1021/acsami.7b09402