3 years ago

Enhanced adhesion of polypropylene to copper substrates

Varying concentrations of maleic anhydride (MAH) were grafted onto three types of polypropylene (PP) in the presence of dicumyl peroxide (DCP). Pull-off adhesive strength from a copper substrate, tensile Young's modulus, and tensile strain-at-break were determined and SEM observations made as a function of the MAH concentration for each PP. One of the PPs plus 3 wt% MAH provides a high value of the adhesive strength along with the Young modulus and the strain-at-break sufficient for the use as a coating for copper wires and cables.

Publisher URL: www.sciencedirect.com/science

DOI: S0142941817302118

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