3 years ago

Printable and Flexible Copper–Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance

Printable and Flexible Copper–Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance
Jinting Jiu, Katsuaki Suganuma, Dawei Hu, Toshiyuki Ishina, Tohru Sugahara, Chuantong Chen, Lingying Li, Wanli Li, Cai-Fu Li
Printable and flexible Cu–Ag alloy electrodes with high conductivity and ultrahigh oxidation resistance have been successfully fabricated by using a newly developed Cu–Ag hybrid ink and a simple fabrication process consisting of low-temperature precuring followed by rapid photonic sintering (LTRS). A special Ag nanoparticle shell on a Cu core structure is first created in situ by low-temperature precuring. An instantaneous photonic sintering can induce rapid mutual dissolution between the Cu core and the Ag nanoparticle shell so that core–shell structures consisting of a Cu-rich phase in the core and a Ag-rich phase in the shell (Cu–Ag alloy) can be obtained on flexible substrates. The resulting Cu–Ag alloy electrode has high conductivity (3.4 μΩ·cm) and ultrahigh oxidation resistance even up to 180 °C in an air atmosphere; this approach shows huge potential and is a tempting prospect for the fabrication of highly reliable and cost-effective printed electronic devices.

Publisher URL: http://dx.doi.org/10.1021/acsami.7b05308

DOI: 10.1021/acsami.7b05308

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