3 years ago

Characterization of waste printed circuit boards recycled using a dissolution approach and ultrasonic treatment at low temperatures

Characterization of waste printed circuit boards recycled using a dissolution approach and ultrasonic treatment at low temperatures
Gintaras Denafas, Regita Bendikiene, Ruta Sidaraviciute, Maksym Tatariants, Samy Yousef
All the WPCB samples had similar structure, which comprises six layers of fiberglass (representing WPCB substrate), two copper foil layers (upper and lower layers), copper tracks, through-hole pads and two soldermask layers (upper and lower layers).

Publisher URL: http://feeds.rsc.org/~r/rss/ra/~3/8Yi2y73xCL4/C7RA07034A

DOI: 2017/RA/C7RA07034A

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