Advanced Functional Materials
Advanced Functional Materials
5 years ago

A Single Droplet-Printed Double-Side Universal Soft Electronic Platform for Highly Integrated Stretchable Hybrid Electronics

A Single Droplet-Printed Double-Side Universal Soft Electronic Platform for Highly Integrated Stretchable Hybrid Electronics
Yongtaek Hong, Eunho Oh, Byeongmoon Lee, Junghwan Byun, Seunghwan Lee, Sangwoo Kim
Soft features in electronic devices have provided an opportunity of gleaning a wide spectrum of intimate biosignals. Lack of data processing tools in a soft form, however, proclaims the need of bulky wires or low-performance near-field communication externally linked to a “rigid” processor board, thus tarnishing the true meaning of “soft” electronics. Furthermore, although of rising interest in stretchable hybrid electronics, lack of consideration in multilayer, miniaturized design and system-level data computing limits their practical use. The results presented here form the basis of fully printable, system-level soft electronics for practical data processing and computing with advanced capabilities of universal circuit design and multilayer device integration into a single platform. Single droplet printing-based integration of rigid islands and core–shell vertical interconnect access (via) into a common soft matrix with a symmetric arrangement leads to a double-side universal soft electronic platform that features site-selective, simultaneous double-side strain isolation, and vertical interconnection, respectively. Systematic studies of island-morphology engineering, surface-strain mapping, and electrical analysis of the platform propose optimized designs. Commensurate with the universal layout, a complete example of double-side integrated, stretchable 1 MHz binary decoders comprised of 36 logic gates interacting with 9 vias is demonstrated by printing-based, double-side electronic functionalization. Single droplet printing of functional ink with geometric optimization enables a double-side universal soft electronic platform that features site-selective, simultaneous double-side (top and bottom) strain-isolating with printed islands, and vertical-interconnecting with printed core–shell vias. Based on the printing-based, double-side electronic functionalization process, highly integrated stretchable hybrid electronics are demonstrated on the platform.

Publisher URL: http://onlinelibrary.wiley.com/resolve/doi

DOI: 10.1002/adfm.201701912

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