Industrial & Engineering Chemistry Research
Industrial & Engineering Chemistry Research
5 years ago

A Novel Imidazole-Core-Based Benzoxazine and Its Blends for High-Performance Applications

A Novel Imidazole-Core-Based Benzoxazine and Its Blends for High-Performance Applications
C. Murthy, K. Srinivasan, A. Hariharan, M. Alagar
In the present work, a novel imidazole-core-based bisphenol (IBP) was synthesized and characterized. The IBP and formaldehyde were reacted separately with aniline and N,N-dimethylaminopropylamine (DMAPA) under appropriate conditions to obtain benzoxazines, which were characterized for their molecular structure and thermal behavior using different analytical methods. Both types of benzoxazines, imidazole core–aniline-based benzoxazines (IBPA-Bz) and imidazole core–DMAPA-based benzoxazines (IBPD-Bz), possess better glass temperatures (Tg) and higher char yields than conventional benzoxazines (bisphenol-F-based benzoxazine (BPFb) and bisphenol-A-based benzoxazine (BPAb)). However, the curing temperature (Tp) of IBPD-Bz is lower than that of IBPA-Bz. The blending of IBPA-Bz with conventional benzoxazines (BPAb and BPFb) improved their thermal stability to an appreciable extent. Furthermore, the addition of bismaleimide cross-linkers (4,4′-diaminodiphenylsulfone- and 4,4′-diaminodiphenylmethane-based bismaleimides) to the blends of IBPA-Bz and conventional benzoxazines improved the thermal behavior according to their nature and concentration. Moreover, the selected blends of benzoxazines were incorporated with 10% loadings of catalysts (4-hydroxyphenylmaleimide, 4-aminophenol, and 4-hydroxyacetophenone), and it was observed that Tp was reduced without significant variation in the thermal behavior, i.e., a reduction of more than 35 °C was noticed for both conventional benzoxazines. On the basis of the data obtained from the different studies, it is concluded that the blends of IBPA-Bz and conventional benzoxazines can be used in the form of sealants, encapsulants, adhesives, and matrixes in the fields of microelectronic and automobile applications for better performance with enhanced longevity.

Publisher URL: http://dx.doi.org/10.1021/acs.iecr.7b01816

DOI: 10.1021/acs.iecr.7b01816

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