3 years ago

Reactive Silver Oxalate Ink Composition with Enhanced Curing Conditions for Flexible Substrates

Silver Oxalate Ink Composition with Enhanced Curing Conditions for
Flexible Substrates
Scott A. Williams, Khushbu R. Zope, Denis Cormier
A solid silver-ligand complex, μ-oxolato-bis(ethylenediaminesilver(I)), was developed for formulating particle-free conductive metal–organic decomposition (MOD) inkjet inks. The complex comprises both a high molar silver content and solubility in inkjet compatible polar solvents. An aqueous ink formulation with 29.5 wt % silver content was developed and inkjet printed onto glass, polyethylene terephthalate, and polyimide substrates. A new hybrid thermal-photonic curing approach resulting in substantially improved electrical properties and substrate adhesion is presented. Silver conductive traces were measured to have bulk resistivity of 4.26 × 10–8 Ω m, which is 2.7 times that of bulk silver. One-pot complex synthesis yielded an easily isolated, and stable, solid product that can be formulated when needed thereby improving shelf life.

Publisher URL: http://dx.doi.org/10.1021/acsami.7b19161

DOI: 10.1021/acsami.7b19161

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