3 years ago

Mechanisms of subsurface damage and material removal during high speed grinding processes in Ni/Cu multilayers using a molecular dynamics study

Mechanisms of subsurface damage and material removal during high speed grinding processes in Ni/Cu multilayers using a molecular dynamics study
Xin Zeng, Jia Li, YouWen Liu, Qiong Wang, QiHong Fang
Molecular dynamics simulation of Ni/Cu multilayers under grinding process with a diamond tip is performed, with the aim of investigating the subsurface damage and material removal in Ni/Cu multilayers.

Publisher URL: http://feeds.rsc.org/~r/rss/ra/~3/Ww0A-zo7png/C7RA06975H

DOI: 2017/RA/C7RA06975H

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